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  1. CLC 16-320

    High strength. A two part, five minute epoxy with high strength for quick repair applications. CLC 16-320

  2. CLC 16-600

    RT Cure, 5 Minute adhesive. Clear when cured, good for quick repairs. CLC 16-600

  3. CLP 7106 / CLI 4010

    Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010

  4. CLR 1020 / CLH 6021

    Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

  5. CLR 1026 / CLH 6021

    Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

  6. CLR 1066 / CLH 6520

    Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

  7. CLR 1066 / CLH 6930

    Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930

  8. CLR 1180 / CLH 6560

    Room temp cure, Excellent shock resistance. An exceptional epoxy casting system with excellent thermal and mechanical shock resistance. CLR 1180 / CLH 6560

  9. CLR 1180 / CLH 6930

    Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930

  10. CLR 1183 / CLH 6560

    Shock resistant, General purpose epoxy. A two component epoxy casting system. product has low shrinkage and excellent shock resistance. CLR 1183 / CLH 6560

  11. CLR 1190 / CLH 6025

    General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025

  12. CLR 1190 / CLH 6560

    Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

  13. CLR 1321 / CLH 5100

    General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1321 / CLH 5100

  14. CLR 1331 / CLH 5515

    Cured epoxy exhibits excellent thermal stability and thermal cycling performance. A two component, heat cured epoxy system, developed specifically for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling performance. Product meets UL94-HB flammability requirements. CLR 1331 / CLH 5515

  15. CLR 1336 / CLH 5515

    Heat Cure Epoxy System formulated for instrument and power transformers. Cured epoxy exhibits excellent thermal stability and thermal cycling performance. The cured material exhibits excellent thermal stability and thermal cycling performance. Product meets UL94-HB flammability requirements. CLR 1336 / CLH 5515

  16. CLR 1337 / CLH 5515

    Cured epoxy exhibits excellent thermal stability and thermal cycling performance. A two component, heat cured epoxy system, developed specifically for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling performance. Product meets UL94-HB flammability requirements. CLR 1337 / CLH 5515

  17. CLR 1396 / CLH 6930

    Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930

  18. CLR 1415 / CLH 6220

    Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220

  19. CLR 1510 / CLH 6580

    Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580

  20. CLR 1796 / CLH 6580

    UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

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